GENESIS Silicon 900 heat sink compound Thermal paste 12.8 W/m·K 2 g NTG-2328

Features

Attribute	Value
Thermal conductivity	12.8 W/m·K
Operating temperature (T-T)	-50 - 250 °C
Density	2.8 g/cm³
Type	Thermal paste

Weight & dimensions

Attribute	Value
Weight	2 g

Packaging data

Attribute	Value
Scraper	Yes
Quantity per pack	1 pc(s)

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GENESIS Silicon 900 Θερμική Πάστα 12.8 W/m·K 2 g NTG-2328
θερμική πάστα, GENESIS, Silicon 900, ψύξη, υπολογιστές, αξεσουάρ, θερμική αγωγιμότητα
GENESIS Silicon 900 Heat Sink Compound Thermal Paste 12.8 W/m·K 2 g NTG-2328
thermal paste, GENESIS, Silicon 900, cooling, computers, accessories, thermal conductivity